Vertiv expands liquid cooling portfolio in EMEA

Vertiv has announced the expansion of its CoolChip CDU product line with the launch of three new models—CoolChip CDU 70, CoolChip CDU 100, and CoolChip CDU 600—across Europe, the Middle East, and Africa

These direct-to-chip liquid cooling solutions strengthen Vertiv’s offering in AI and high-performance computing (HPC) infrastructure. The CoolChip CDU 600 will be unveiled for the first time in EMEA at the Datacloud Global Congress in Cannes this week.

“As workloads continue to drive higher rack densities and cooling demands, customers need liquid cooling solutions that adapt to their unique deployment strategies, whether retrofitting an existing environment or scaling a new build,” said Sam Bainborough, vice-president, EMEA thermal business at Vertiv. “The CoolChip CDU family offers flexible, scalable solutions that simplify deployment and support long-term growth. By reducing integration complexity and adapting to a range of data centre environments, these CDUs help organisations scale liquid cooling more efficiently.”

Why liquid cooling?

The new models are designed for both retrofit and greenfield environments and include in-rack and row-based configurations with liquid-to-air and liquid-to-liquid technology options. These systems provide scalable and flexible liquid cooling solutions to meet growing capacity requirements and support the wider adoption of liquid cooling.

The CoolChip CDU range forms part of Vertiv’s broader liquid cooling portfolio and the 360AI suite, which integrates power, cooling, and services to address the unique demands of AI infrastructure. Supported by global liquid cooling services that include design, installation, commissioning, fluid management, and maintenance, the portfolio accommodates a broad set of use cases, from upgrading existing sites to deploying high-density AI and HPC clusters in new facilities.

The CoolChip CDU 70 is a liquid-to-air in-row unit that enables a quick and cost-effective introduction of liquid cooling in both new and retrofitted data centres. It leverages existing thermal infrastructure, making it suitable for facilities aiming to adopt liquid cooling with minimal disruption. With a cooling capacity of up to 70 kW, the system is engineered for agility and scalability, reducing secondary fluid network complexity and overall infrastructure footprint. Its integrated controller enables real-time monitoring, group control, and communication between units for coordinated performance and streamlined management across racks.

The CoolChip CDU 100 delivers high-performance, liquid-to-liquid in-rack cooling in a compact 4U design, making it ideal for managing dense workloads in individual racks. This model allows data centre operators to roll out or expand liquid cooling one rack at a time, which is particularly useful for AI pilots or incremental scaling without major infrastructure changes. Offering up to 100 kW of cooling, the system includes a large-surface heat exchanger for low approach temperatures and features such as an integrated controller for monitoring and control, precise ±1°C temperature regulation, fluid filtration, and separation between facility and IT fluid loops for secure and efficient operation.

The CoolChip CDU 600 is a liquid-to-liquid in-row unit delivering 600 kW of cooling capacity, tailored for high-density AI and HPC applications in hyperscale and colocation environments. Its modular design supports in-row deployment with top or bottom piping options and optional internal manifolds, enabling faster planning and implementation. With redundant pumps, advanced temperature and fluid quality monitoring, and deployment flexibility, the CDU 600 is built to offer the performance, reliability, and transparency needed to scale liquid cooling in demanding IT environments.